{"id":13765,"date":"2009-04-27T00:00:00","date_gmt":"2009-04-27T00:00:00","guid":{"rendered":"https:\/\/www.dmcinfo.com\/our-work\/silicon-wafer-processing\/"},"modified":"2025-05-29T22:28:27","modified_gmt":"2025-05-29T22:28:27","slug":"silicon-wafer-processing","status":"publish","type":"our_work","link":"https:\/\/www.dmcinfo.com\/our-work\/silicon-wafer-processing\/","title":{"rendered":"Silicon Wafer Processing"},"content":{"rendered":"

The system is controlled by Steeplechase, an 8-axis MEI DSP motion control card and Allen Bradley Devicenet I\/O. Citect and Visual Basic applications supplement the HMI. An X\/Y linear stage along with an angular axis is used to position silicon wafers for processing. A DVT camera is used to obtain wafer position information allowing compensation for the slight variations in placement for the tooling, which is\u00a0crucial for high-accuracy processing.<\/p>\r\n

\"Measurement
Measurement Screen<\/figcaption><\/figure><\/figure>","protected":false},"excerpt":{"rendered":"

The system is controlled by Steeplechase, an 8-axis MEI DSP motion control card and Allen Bradley Devicenet I\/O. Citect and Visual Basic applications supplement the HMI. An X\/Y linear stage along with an angular axis is used to position silicon wafers for processing. A DVT camera is used to obtain wafer position information allowing compensation […]<\/p>\n","protected":false},"author":8,"featured_media":13763,"template":"","meta":{"customer":"Lexmark","summary":"

DMC consulted on a large-scale project for a semi-conductor manufacturer to overhaul the architecture and provide technical direction for a new line of micro-motion manufacturing systems.<\/p>\r\n","description":"","customer_benefits":"

    \r\n
  • Improves process accuracy to within a 5 micron tolerance<\/li>\r\n
  • Reduces production time with increased speed<\/li>\r\n
  • Top level project consulting and coordination allowed large-scale project to meet deadlines<\/li>\r\n<\/ul>\r\n","components_used":"
      \r\n
    • 8 axis MEI DSP motion card<\/li>\r\n
    • Allen Bradley DeviceNet I\/O<\/li>\r\n
    • NEAT linear servo motors, amplifiers<\/li>\r\n
    • DVT Vision Inspection Cameras<\/li>\r\n
    • Citect HMI<\/li>\r\n
    • Custom Microsoft Visual Basic<\/li>\r\n
    • 6.0® Active X Components<\/li>\r\n
    • Microsoft Access® ODBC database<\/li>\r\n<\/ul>\r\n","project":"DT System Training","author":"Ken Brey","notes":""},"work_category":[699,680,702,684],"class_list":["post-13765","our_work","type-our_work","status-publish","has-post-thumbnail","hentry","work_category-machine-vision","work_category-manufacturing-automation-and-intelligence","work_category-semiconductor","work_category-test-measurement-automation"],"yoast_head":"Silicon Wafer Processing | DMC, Inc.<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.dmcinfo.com\/our-work\/silicon-wafer-processing\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Silicon Wafer Processing\" \/>\n<meta property=\"og:description\" content=\"The system is controlled by Steeplechase, an 8-axis MEI DSP motion control card and Allen Bradley Devicenet I\/O. 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